| 摘要 |
An electronic component packing method employing a cutting line is provided to adopt a transparent container accommodating an electronic component for a hard board sheet in order to reduce manufacturing cost of a packing material and improve productivity. An electronic component packing method employing a cutting line comprises the following steps. A printing layer(3) including information such as a product name is formed on a hard board sheet(2) which is a backside of a polyethylene resin layer. A band-type tape(4) is adhered to a middle part or an upper part of the hard board sheet by using a roller. A cutting part(24) is cut by a cutting knife. A surface protecting adhesive film(5) is adhered to a surface using the roller.
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