CIRCUIT BOARD, METHOD OF FORMING WIRING PATTERN, AND METHOD OF MANUFACTURING CIRCUIT BOARD

摘要

A wiring board a method for forming a wiring pattern, and a method for manufacturing a wiring board are provided to obtain high conductivity by using a conductive paste made of metal powder with a high resistance value and the resin. A conductive paste made of the metal powder and the thermoplastic resin is printed in a wiring board(10A). A film thickness of a second conductive paste is thinner than the film thickness of the first conductive paste. A wiring pattern(12a) is formed by heating and pressing the conductive paste.