| 摘要 |
A multi-substrate region based package and a manufacturing method thereof are provided to improve compatibility and reliability by coupling a plurality of substrates with the other functional regions of a chip. A multiple substrate region based package includes a chip(40), a plurality of substrates(31), a plurality of bonding wires(41) and an encapsulation layer(42). A chip has an active surface(400) and an inactive surface(401). The active surface of the chip is classified into a plurality of function regions. Each functional region includes a first electrical connection unit. Each substrate is mounted on a corresponding region of function regions of the chip. Each substrate includes a plurality of bond pads and a second electrical connection unit(313). The second electrical connection unit corresponds to the first electrical connection unit of the corresponding region among the function regions of the chip. A plurality of bonding wires electrically connects the first electrical connection units to the corresponding second electrical connection units. The encapsulation layer encapsulates the active surface of the chip, the substrates and the bonding wires. The encapsulation layer has a plurality of openings. The bond pad of the substrates is exposed to the plurality of openings. |
