| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a wiring board by which a thin wiring board with high density can be efficiently manufactured. SOLUTION: The manufacturing method for the wiring board includes the processes of: laminating a plurality of insulating layers and conductor layers alternately on metal foil 11 of metal foil with a base film having the metal foil 11 held on the base film 1 with an adhesion layer interposed therebetween to form a laminate 10 for a wiring board comprising the metal foil 11, the insulating layers, and the conductor layers; and separating the laminate 10 from the base film 1. It is preferable that the manufacturing method includes, before the process of forming the laminate 10, a process of laminating the metal foil with the base film on a principal surface of the support substrate 3 having the flat principal surface with a top surface of the metal foil 11 exposed to form the laminate 10 by laminating the plurality of insulating layers and conductor layers alternately on the exposed top surface of the metal foil 11. COPYRIGHT: (C)2009,JPO&INPIT |
