| 摘要 |
PROBLEM TO BE SOLVED: To propose a method for manufacturing a multilayer printed wiring board having filled via structure and advantageous for forming a fine pattern. SOLUTION: The multilayer printed wiring board includes alternately stacked conductor circuit and interlayer resin insulating layer. Manufacturing steps of the multilayer printed wiring board include at least the following (1)-(6) steps: (1) a step to form a lower layer conductor circuit on a substrate; (2) a step to form an interlayer resin insulating layer coating the lower layer conductor circuit, and to form an opening part to reach the lower layer conductor circuit; (3) a step to form a nonelectrolytic plated film on a surface of the interlayer resin insulating layer; (4) a step to form a plating resist; (5) a step to form a conductor layer by applying electrolytic plating; and (6) a step to remove the plating resist, and also to remove the nonelectrolytic plated film beneath the plating resist. Thickness of the upper layer conductor circuit is less than the half of the via hole diameter, and less than 25μm. COPYRIGHT: (C)2009,JPO&INPIT |
