| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a biochip package which is made compatible between optimized mass production use and general use, and to provide a biochip package substrate which is to be used for the same. <P>SOLUTION: The biochip package comprises the biochip on which a probe array is provided and the package substrate provided with a through-cavity for exposing the back surface of the biochip through a through-hole, when it is mounted on the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
