<p>In one embodiment, the process for forming a multilayer film (18) comprises disposing a supportive layer (16) adjacent to an imprinting layer (14) to form a multilayer film and imprinting microstructures in the imprinting layer as the multilayer film passes between a heated roller (112) and a compression roller (116-124). The multilayer film is free of a removable carrier layer. The supportive layer has a supportive layer glass transition temperature that is greater than or equal to about 15·C higher than the imprinting layer glass transition temperature and/or the supportive layer has a supportive layer melting temperature that is greater than or equal to about 15·C higher than an imprinting layer melting temperature. The imprinting temperature is lower than the supportive layer (18) melting temperature.</p>
申请公布号
WO2009023023(A1)
申请公布日期
2009.02.19
申请号
WO2007US75799
申请日期
2007.08.13
申请人
GENERAL ELECTRIC COMPANY;HU, YU;VAISH, NITIN;CAPALDO, KEVIN, PATRICK;YEUNG, CHUNGHEI