发明名称 Shallow Trench Isolation with Improved Structure and Method of Forming
摘要 A shallow trench isolation (STI) structure has a top portion tapering in width from wide to narrow in a direction from a substrate surface, from a first width at a top of the first portion to a second width at a bottom of the first portion. The STI structure also includes a bottom portion below the top portion, which expands from the bottom of the top portion to a substantially widened lateral distance having a third width. The third width is, in general, substantially larger than the second width. The inventive STI structure can provide desired isolation characteristics with a significantly reduced aspect ratio, thus suitable for device isolations in advanced processing technology.
申请公布号 US2009045482(A1) 申请公布日期 2009.02.19
申请号 US20070838666 申请日期 2007.08.14
申请人 LIAW JHON-JHY;CHEN CHAO-CHENG;CHANG CHIA-WEI 发明人 LIAW JHON-JHY;CHEN CHAO-CHENG;CHANG CHIA-WEI
分类号 H01L29/00 主分类号 H01L29/00
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