CONDUCTIVE RESIN COMPOSITION AND SUBSTRATE HAVING CONDUCTIVE PATTERN OBTAINED BY USING THE SAME

摘要

Disclosed is a conductive resin composition which is excellent in oxidation resistance at high temperatures and enables to form a conductive pattern during fine pattern formation. Also disclosed is a substrate having a low-cost conductive pattern using such a conductive resin composition. Specifically disclosed is a conductive resin composition containing an organic binder (A) and a conductive powder (B), which is characterized in that the conductive powder (B) contains a two-layer-coated copper particle (C) having a core of a copper particle, a first metal coating layer formed on the surface of the copper particle and a second metal coating layer as the outermost layer. The conductive resin composition is further characterized in that the first metal coating layer is composed of at least one element selected from Ni, Co, Mn and Cr, and the second metal coating layer is composed of Ag. Also specifically disclosed is a substrate having a conductive pattern formed by using the conductive resin composition.