| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting a circuit member, in which warping deformation of a substrate after packaging of a circuit member like an IC chip can be sufficiently prevented without depending on whether a curing temperature of a thermosetting connection member for use is high or low and a circuit connector having a sufficiently high connection reliability can be manufactured. SOLUTION: The circuit member mounting method includes: a thermal press-bonding process where after interposing a thermosetting connection member 2 between a substrate 1 and a circuit member 3 to be mounted on the substrate 1, the substrate 1 and the circuit member 3 are pressed while heating them to cure the thermosetting connection member 2, for bonding the substrate 1 and the circuit member 3 so that an electrode 1a of the substrate 1 and an electrode 3a of the circuit member 3 are electrically connected; and a reheating step of heating again the circuit connector obtained through the thermal press-bonding process. COPYRIGHT: (C)2009,JPO&INPIT
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