| 摘要 |
<p>Disclosed is a method of forming a multi layer thin film, including forming first and second contact holes by irradiating a laser beam on a metal pattern having an open defect; filling the first and second contact holes with a metal thin film by irradiating a laser beam; forming a metal thin film between the first and second contact holes by irradiating a laser beam; and forming a passivation film made of SixNy or SiO2 to protect the metal thin film. The method further includes pre-cleaning the surface of a region of the metal pattern, on which the metal thin film is formed, before the formation of the metal thin film, thus increasing the adhesive force of the metal thin film and remarkably reducing a possibility that the metal thin film is arbitrarily removed.</p> |
