发明名称 SOLDERABLE EMI GASKET AND GROUNDING PAD
摘要 Apparatus (10), which is useful as both a conductive gasket and a grounding pad, which has a compressible elastomeric substrate (11) having at least one side surface (12) and two ends, a conductive elastomeric layer (14) adjacent to all of the side surfaces of the compressible substrate, and a metal layer (15) adjacent to the conductive layer.
申请公布号 WO2009005584(A3) 申请公布日期 2009.02.19
申请号 WO2008US07452 申请日期 2008.06.13
申请人 GORE ENTERPRISE HOLDINGS, INC.;ZONVIDE, KOSSI;THRETHEWEY, JEREMY 发明人 ZONVIDE, KOSSI;THRETHEWEY, JEREMY
分类号 H05K9/00 主分类号 H05K9/00
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