发明名称 |
SOLDERABLE EMI GASKET AND GROUNDING PAD |
摘要 |
Apparatus (10), which is useful as both a conductive gasket and a grounding pad, which has a compressible elastomeric substrate (11) having at least one side surface (12) and two ends, a conductive elastomeric layer (14) adjacent to all of the side surfaces of the compressible substrate, and a metal layer (15) adjacent to the conductive layer. |
申请公布号 |
WO2009005584(A3) |
申请公布日期 |
2009.02.19 |
申请号 |
WO2008US07452 |
申请日期 |
2008.06.13 |
申请人 |
GORE ENTERPRISE HOLDINGS, INC.;ZONVIDE, KOSSI;THRETHEWEY, JEREMY |
发明人 |
ZONVIDE, KOSSI;THRETHEWEY, JEREMY |
分类号 |
H05K9/00 |
主分类号 |
H05K9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|