发明名称 HIGH DIELECTRIC FILM
摘要 PROBLEM TO BE SOLVED: To provide a high dielectric film which can be made thin having a high dielectric property, and has a superior winding property (flexibility) and small dielectric loss. SOLUTION: Provided is the high dielectric film which contains a vinylidene fluoride polymer (A) and compound oxide particles (B) expressed by formula M<SP>1</SP><SB>a</SB>M<SP>2</SP><SB>b</SB>O<SB>c</SB>, the high dielectric film containing 10 to 500 parts by mass of the compound oxide particles (B) for 100 parts by mass of the vinylidene oxide polymer (A). In the formula, M<SP>1</SP>and M<SP>2</SP>are different from each other, M<SP>1</SP>is a group II metal element in a periodic table, and M<SP>2</SP>is a metal element of a fifth period in the periodic table, where (a) is 0.9 to 1.1, (b) is 0.9 to 1.1, and (c) is 2.8 to 3.2. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009038088(A) 申请公布日期 2009.02.19
申请号 JP20070198874 申请日期 2007.07.31
申请人 DAIKIN IND LTD 发明人 KO MEITEN;YOKOYA KOJI;MATSUMURA YOSHIHARU;MUKAI SHIGESATO;KOMATSU NOBUYUKI
分类号 H01G4/20;H01B3/00;H01B3/44;H01B17/56 主分类号 H01G4/20
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