| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide miniaturization and improved high-speed operation of a chip scale package of a semiconductor device, which is operated at a high frequency. <P>SOLUTION: A chip package 40 achieves miniaturization and excellent high-speed operation by employing flip chip interconnection between a die 24 and a package substrate 42 and mounting a chip on the same side of the package substrate 42 as solder balls 28 for the second level interconnection to a printed circuit board. Also, two die packages have a first die attached to the same surface as the second level interconnect structures and connected using flip chip interconnection, and a second die 44 connected to the opposite surface of the substrate and interconnected either by wire bonding or by flip chip interconnection. <P>COPYRIGHT: (C)2009,JPO&INPIT |
