METHOD FOR MANUFACTURING SUSPENSION SUBSTRATE WITH CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a suspension substrate with circuit capable of precisely mounting an electronic component and connecting a terminal of the electronic component with a terminal part of a conductor pattern with high precision. SOLUTION: A conductor pattern 4 formed on a base insulation layer 3 created on a metal support substrate 2 and having terminal parts 5 for connecting with a magnetic head, and a mark 9 formed on the metal support substrate 2 or on the base insulation layer 3 and having an opening hole 16 for creating a reference hole 10 for mounting the magnetic head are simultaneously formed. The reference hole 10 is formed by etching the metal support substrate 2 or the metal support substrate 2 and base insulation layer 3 arranged within the opening hole 16 of the mark 9. COPYRIGHT: (C)2009,JPO&INPIT