POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a positive photosensitive resin composition containing a polyamide resin (A) composed of a structural unit represented by the formula (1) below and a structural unit represented by the formula (2) below, and a photosensitive compound (B). This positive photosensitive resin composition is characterized in that the polyamide resin (A) has a weight average molecular weight Mw of 5,000-80,000, and a cured film obtained by curing the positive photosensitive resin composition at 250°C has a tensile modulus of 2.0-4.0 GPa and a tensile elongation of 10-100%. (1) (2) This positive photosensitive resin composition can be cured at low temperatures. Also disclosed is a semiconductor device having a cured film of such a positive photosensitive resin composition, which is excellent in reliability.