| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wafer level chip size package for reducing the bending of a semiconductor wafer. SOLUTION: A photosensitive polyimide resin layer 3 and a rewiring layer 7 are formed on the surface of a semiconductor wafer 2 on which a semiconductor chip 1 is created, and then a photosensitive polyimide resin layer 10 is formed on the backface of a semiconductor wafer 2. Then, a recess 12 is formed along a scribe line 11 from the surface of the semiconductor wafer 2, and then the semiconductor wafer is cut into individual pieces by carrying out backface grinding. COPYRIGHT: (C)2009,JPO&INPIT
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