| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic equipment case that can be manufactured inexpensively and further can be made thin by reducing the number of components, facilitating component management, and decreasing assembling processes. SOLUTION: A printed circuit board fitting frame 30 is formed by extrusion, and is provided with sidewalls 32 and 33 which project upward and downward at a predetermined height along both right and left sides of a flat plate type intermediate partition plate 31. The intermediate partition plate 31 is provided with printed circuit board fitting portions 34 to 36 of predetermined height on both top and bottom surfaces along inner sides of the center and the sidewalls 32 and 33. Screw holes 37 for fixation to a case main body are bored in the sidewalls 32 and 33 at both upper and lower portions along the length. The printed circuit board fitting frame 30 is subjected to boring processing after the extrusion to form a plurality of printed circuit board fitting holes 41 at upper and lower identical positions of the substrate fitting portions 34 to 36 and also to form a plurality of cover fitting holes 42 in upper and lower surfaces of the sidewalls 32 and 33, and then housed in a main body case 44 which has the top and both right and left side portions made open, and an upper cover 47 is mounted on the top opening portion. COPYRIGHT: (C)2009,JPO&INPIT
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