| 摘要 |
The present invention relates to wiring using a patterned monostratal conductive fine particle film in which the selectively formed monostratal conductive fine particle film is covalently bound to the surface of the base material via a first organic coating selectively formed on the surface of the base material and a second organic coating formed on the surface of the conductive fine particles, and further the wiring comprises the foregoing organic coatings that are different from each other. |
