WAFER TABLE, SURFACE PROTECTION FILM REMOVING APPARATUS AND SURFACE PROTECTION FILM REMOVING METHOD

摘要

A wafer table (31) is provided for sucking a wafer (20). The wafer is supported by a mount frame (36) on the rear surface through a dicing film (3), and a surface protection film (11) is attached to the front surface of the wafer. On the wafer table, a groove (60) is formed on a region which corresponds to at least a part of the outer circumference of the wafer. Furthermore, the table is provided with a suction means (33) for sucking the wafer to the surface of the table, and a vacuum means for sucking the air from the groove. Thus, the dicing film is surely depressed into the groove and is also recovered to the original position.