| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a photosensitive resin composition having excellent lithography performance and capable of forming a cured relief pattern excellent in mechanical characteristics and heat resistance through low-temperature curing; a cured relief pattern production method using the photosensitive resin composition; and a semiconductor device including a cured relief pattern obtained by the production method. <P>SOLUTION: The photosensitive resin composition comprises a resin comprising a specific repeating unit, a photosensitive agent, a thermo-acid generator, and a compound having at least one of an alkoxymethyl group and an acyloxymethyl group. There are also provided: the cured relief pattern production method using the photosensitive resin composition; and the semiconductor device including a cured relief pattern obtained by the production method. <P>COPYRIGHT: (C)2009,JPO&INPIT |
