| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cleaning a slurry supply device capable of surely eliminating microorganisms attached to and bred on any of portions from a supply line of a polishing liquid to a supply line for supplying a slurry of a mixture liquid composed of a plurality of the polishing liquids to a polishing device, and the slurry supply device using the same. SOLUTION: A tetra-methyl-ammonium-hydroxide liquid (a TMAH liquid 39) is supplied to any part of the portions from the supply line 7 of an abrasive grain dispersion liquid of the polishing liquid to the slurry supply line 32 for supplying the slurry of the mixture liquid composed of the plurality of the polishing liquids to the polishing device. After discharging the TMAH liquid 39, hydrogen peroxide solution 50 is supplied and discharged. COPYRIGHT: (C)2009,JPO&INPIT |
