| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique using an anisotropic conductive adhesive (ACA) or a non-conductive adhesive (NCA) in a semi-cured initial state in order to improve non-solder flip chip techniques. SOLUTION: A wafer-level flip chip package is manufactured by steps of: applying a mixture solution 115 containing an insulating polymer resin, a curing agent, and an organic solvent onto a wafer 100 having a non-solder bump formed thereon and then drying the wafer to initialize the mixture 115 applied on the wafer 100 into a semi-cured state (B-stage); dicing the dried wafer 100 into individual chips 200; aligning the diced semiconductor chips 200 with electrodes of a substrate 300 and then applying heat and pressure to perform flip chip connection. Since an adhesive is directly coated on the wafer in a solution state and is used, shadow effects being apt to occur on a wafer surface being not flat can be prevented, and the thickness of coating is easy to control. COPYRIGHT: (C)2009,JPO&INPIT |
