| 摘要 |
PROBLEM TO BE SOLVED: To solve the inconvenience that, when supporting one end portion of a piezoelectric vibrating element on a small-sized circuit component such as a chip component by a conductive adhesive, during a period in which holding power of the conductive adhesive is made weak because of a non-hardened state, an adhered portion is released by its own weight of the piezoelectric vibrating element. SOLUTION: A piezoelectric oscillator includes: a package main body 21 which includes an external electrode in its bottom portion and includes an IC packaging conductive pad 21b conducted with the external electrode; an IC chip 22 conducted and connected on the conductive pad of the package main body; a piezoelectric vibrating element 23 which is supported, at one edge at least, to an upper electrode 22c in an upper portion of the IC chip by a conductive adhesive B; and a cover member 24 which air-tightly seals an upper surface of the package main body including the IC chip and the piezoelectric vibrating element, wherein the IC chip has a length exceeding a distance from the one edge of the piezoelectric vibrating element to a position of the center of gravity. COPYRIGHT: (C)2009,JPO&INPIT
|
