| 摘要 |
PROBLEM TO BE SOLVED: To prevent, as much as possible, unwanted thermal influence of a supporting pin on a substrate by reducing thermal influence from ambient temperature on the supporting pin to support the substrate to be processed. SOLUTION: A substrate lifting mechanism 126 includes a lifting pin air-cooling section for cooling the lifting pin 128 to the desired constant temperature. In this lifting pin air-cooling section, an air-cooling gas CA supplied via an air-cooling gas supplying pipe 152 from an air-cooling gas supplying source 150 is introduced from an aperture of the lower end of pin into the lifting pin 128 (pin body 128a). The air-cooling gas CA introduced from the lower side into the lifting pin 128 flows to the upper side of the hollow space within the pin and is exhausted outside the pin form each ventilation hole 128c at the area near the end part of the pin. COPYRIGHT: (C)2009,JPO&INPIT |
