| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that is superior in environmental resistance, which enables its connection process with an external circuit to be observed visually. SOLUTION: A protection layer 22 is disposed on the surface of a sensor chip 20, and an electrode 21 is arranged on the lateral side of the sensor chip 20 so as to be exposed. The exposed part of the electrode 21 is covered by a corrosion-proof metal 27, and the electrode 21 is electrically connected to the corrosion-proof metal 27. In this configuration, the corrosion-proof metal 27 is disposed on the lateral side of the sensor chip 20, thereby the connection process of the corrosion-proof metal 27 and the external circuit can be observed visually. Moreover, since the surface of the sensor chip 20 is covered by the protective layer 22, and the exposed part of the electrode 21 on the lateral side of the sensor chip 20 is covered by the corrosion-proof metal 27, its environmental resistance is also superior. COPYRIGHT: (C)2009,JPO&INPIT
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