发明名称 RESIN STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a thermoplastic resin structure which has good vapor and/or liquid transmission resistance even when used under high humidity, the dimension of which is restrained from being changed due to moisture absorption, the mechanical properties such as rigidity of which are also restrained from being deteriorated and which has excellent characteristics when absorbing water, and to provide a multilayer structure giving plastic containers and tubular bodies having excellent barrier properties, strength, durability and workability and uses of the thermoplastic resin structure and the multilayer structure. SOLUTION: The thermoplastic resin structure is formed from a resin composition comprising substantially (a) 55-80 volume% polyamide resin (PA) and (b) 45-20 volume% polyphenylene sulfide resin (PPS). The melt viscosity ratio of (a) the polyamide resin to (b) the polyphenylene sulfide resin is 1.1-10. The thermoplastic resin structure is characterized in that, in morphology therein seen through an electron microscope, (b) the polyphenylene sulfide resin forms a matrix phase (continuous phase) and (a) the polyamide resin forms a disperse phase. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009035731(A) 申请公布日期 2009.02.19
申请号 JP20080185874 申请日期 2008.07.17
申请人 TORAY IND INC 发明人 MATSUOKA HIDEO;HAMAGUCHI MITSUSHIGE;KOBAYASHI KAZUHIKO
分类号 C08L77/00;B65D1/00;B65D65/40;B65D81/24;C08K3/00;C08L81/02 主分类号 C08L77/00
代理机构 代理人
主权项
地址