| 发明名称 |
CARRIER SUBSTRATE AND INTEGRATED CIRCUIT |
| 摘要 |
A carrier substrate comprising a through contact connecting a first contact field on a top face of the carrier substrate to a second contact field on a bottom face of the carrier substrate and a substrate material being provided around the through contact.
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| 申请公布号 |
US2009045512(A1) |
申请公布日期 |
2009.02.19 |
| 申请号 |
US20070839440 |
申请日期 |
2007.08.15 |
| 申请人 |
HEDLER HARRY;MEYER THORSTEN |
发明人 |
HEDLER HARRY;MEYER THORSTEN |
| 分类号 |
H01L23/48;H01L21/44 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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