STABLIZER FOR ELECTROLESS NICKEL PLATING SOLUTION

摘要

A stabilizer of non-electrolytic nickel plating solution is provided to prevent generation of bath analysis during plating in long time by using a thallic compound and a thio-compound. A stabilizer of non-electrolytic nickel plating solution comprises: 5mg/L~500mg/L of thio-compound selected from thioglycolic acid, dithioglycolic acid, thiodiglycolic acid and dithiodiglycolic acid; and 0.5mg/L~50mg/L of thallic compound selected from thallium nitrate and thallium sulfate.