| 摘要 |
PROBLEM TO BE SOLVED: To prevent solder bridging between adjacent pins which has been caused during solder-flow mounting of a narrow-pitch component. SOLUTION: The shape of a land for solder absorption is changed according to the shape of a backup land so as to make the backup land absorb excessive solder. Alternatively, the shape of the land for solder absorption is changed according to the area of the backup land. Alternatively, the shape of the land for solder absorption is changed according to the direction of a terminal array to a flow soldering direction. COPYRIGHT: (C)2009,JPO&INPIT
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