发明名称 LIGHT EMITTING DIODE PACKAGE, DIRECT TYPE BACKLIGHT MODULE AND EDGE TYPE BACKLIGHT MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting diode (LED) package with high light extraction efficiency and direct type and edge type backlight modules capable of providing a uniform plane light source. <P>SOLUTION: The LED package 100 includes a carrier 110, an LED chip 120 and a light scattering material 130. The LED chip is disposed on the carrier, electrically connected with the carrier and adapted to emitting the light of a wavelength &lambda;<SB>1</SB>. The light scattering material is disposed on the carrier and includes scatters 132 for scattering the light. A material of the scatters is a birefringent material (e.g. barium carbonate or the like) or nitride (e.g. boron nitride). The present invention further provides the direct type and the edge type backlight modules whose diffusion plates have the scatters. Since the light can be scattered by the scatters, an effect of light mixing in the LED package and the uniformity of the backlight modules can be enhanced. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009038334(A) 申请公布日期 2009.02.19
申请号 JP20070316339 申请日期 2007.12.06
申请人 LIGHTHOUSE TECHNOLOGY CO LTD 发明人 HO HSIN-HUA;HWANG WEN-JENG
分类号 H01L33/50;F21S2/00;F21V8/00;F21Y101/02;H01L33/54;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/50
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