| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving electrical characteristics even if using a first metal circuit board as an electric circuit while suppressing distortion generated in the bonding part of a semiconductor element and the first metal circuit board. SOLUTION: The semiconductor device is provided with a metal circuit board 3 and a semiconductor chip 1 mounted to the surface of the metal circuit board 3. Further, an expansion suppressing member 11 having a thermal expansion coefficient smaller than a thermal expansion coefficient of the metal circuit board 3 is bonded at a position surrounding the semiconductor chip 1 on the surface of the metal circuit board 3. COPYRIGHT: (C)2009,JPO&INPIT |
