ELECTROLESS PALLADIUM PLATING SOLUTION

摘要

A non-electrolytic palladium plating solution is provided to control precipitating rate of plating layer by setting up befittingly palladium concentration. A non-electrolytic palladium plating solution includes a first complexing agent, a second complexing agent, phosphoric acid or phosphate, sulfuric acid or sulfate and formic acid or alkyl formate. The first complexing agent is organic palladium complex which has ethylenediamine as ligand and selected from a group consisting of dichloro diethylene diamine palladium, dinitrite diethylene diamine palladium and diacetate diethylene diamine palladium. The second complexing agent is carboxyl group or chelating agent having the salt and/or water soluble aliphatic organic acid or the salt of the water soluble aliphatic organic acid. The carboxyl group or chelating agent having the salt is ethylene diamine tetraacetic acid or sodium salt of the ethylene diamine tetraacetic acid and potassium salt or ammonium salt.