| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technique capable of improving setting accuracy of a resistance value. <P>SOLUTION: A resistor chip 1A includes a resistor 2A and electrode pads 3A and 3B for pull-out electrically connected to both ends of it. The resistor 2A is a resistor main body for setting the resistance value and is embedded inside a resistor forming groove 4a formed on an insulating film on a semiconductor substrate 5. The electrode pads 3A and 3B for pull-out are embedded inside a pad groove 4b formed on the insulating film on the semiconductor substrate 5. By forming the resistor 2A using a semiconductor process (lithography, etching and chemical-mechanical polishing or the like), the work dimension errors of the width and film thickness of the resistor 2A are reduced. Thus, the setting accuracy of the resistance value of the resistor chip 1A is improved. Also, since the resistor chip 1A can be refined, it can be highly integrated as well. Further, since a manufacturing method used in the manufacturing process of the semiconductor device is used, the reliability of the resistor chip 1A is improved as well. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
