| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer wiring board in which adverse influences of plating resist residues are removed, and formation of an upper layer wiring layer and filling of a via hole are performed by electrolytic plating. <P>SOLUTION: In the manufacturing method of the multilayer wiring board wherein a prepreg 3 and metal foil 4 thereupon are laminated on a circuit-formed internal layer material 2 in one body, the via hole 5 is formed with laser after the metal foil is patterned in a hole shape, and the formation of the upper layer wiring layer and the filling of the via hole are performed through electrolytic plating, a ground electroless plating layer 7 on the upper wiring layer is etched away until the film thickness of the ground electroless plating layer 7 becomes less than a half and then the via hole 5 is filled through electrolytic filling plating 9. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
