发明名称 FORMING METHOD OF CONDUCTIVE FILM PATTERN, WIRING BOARD, AND DISPLAY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a forming method of a conductive film pattern in which the conductive film pattern having a narrow line width is formed by a simple process, a wiring board formed using the conductive film pattern, and a display device. SOLUTION: The forming method of forming the conductive film pattern on the substrate by using a droplet coating method includes processes of: forming a plurality of projection structures spaced apart from one the other in a part where the conductive film pattern is formed; dripping a droplet having a conductive material dissolved or dispersed in a solvent between the projection structures; evaporating the solvent to form the conductive film pattern of the conductive material between the projection structures. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009038185(A) 申请公布日期 2009.02.19
申请号 JP20070200599 申请日期 2007.08.01
申请人 KONICA MINOLTA HOLDINGS INC 发明人 MORIMOTO TAKASHI
分类号 H01L21/3205;G09F9/30;H01L21/288 主分类号 H01L21/3205
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