| 摘要 |
PROBLEM TO BE SOLVED: To provide a panel laminating system capable of maintaining a substrate in a high flatness degree, and to provide a panel laminating method. SOLUTION: An adhesive mechanism section 52 is placed between supporting rods of an upper substrate holding device on a lower face of an upper surface plate; and a pressure plate 71 of the adhesive mechanism section 52 has a plurality of through holes formed between support rods (suction pads) adjacent to the adhesive mechanism section 52. The adhesive mechanism section 52 is equipped with: a suction head 75 that is vertically movably supported within the through hole 72; and an actuator 76 for vertically moving the suction head 75. A first substrate carried into a chamber by the upper substrate holding device is received by suction with the suction head 75 and then adhered and held by the adhesive sheet 74 provided on the pressure plate 71 by upward movement of the suction head 75. COPYRIGHT: (C)2009,JPO&INPIT
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