| 摘要 |
<p>As laminated - filament lattice for the chemical mechanical polishing, the effective fluid flux and the high contact surface area are provided within pad, and the pitch is highly controlled and the contact mechanics with substrate can be controlled the stiffness of the grinding filament. A grinding pad polishing one or greater among electromagnetic, and the optics and semiconductor substrate includes a plurality of layer(200) of the grinding filament laminated on the base layer(204) of the grinding filament. A plurality of layers of the grinding filament(202) is formed each grinding filament layer is adhered to on the lower part grinding filament and it laminates successively and is parallel to the abrasive face of the grinding pad. Each grinding filament of a plurality of layers are formed the grinding pad having the opening lattice structure of the grinding filament which is puts on the grinding filament more than three.</p> |
