| 摘要 |
<P>PROBLEM TO BE SOLVED: To more improve a contactness between a lead and an envelope than heretofore. <P>SOLUTION: In the lead terminal type semiconductor device, which comprises the lead 21, a semiconductor chip 22 mounted on the lead 21, a bonding wire 25 connecting the lead 21 and semiconductor chip 22 to each other, and the envelope 26 sealing a portion of the lead 21, the semiconductor chip 22, and the bonding wire 25 with resin, a projection 23 is provided on the lead 21 in contact with the envelope 26. <P>COPYRIGHT: (C)2009,JPO&INPIT |
