| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming an adhesion layer, by which an adhesion layer of a thin film can be stably formed by overcoming the defects in the dispense, stamping, screen printing method and the like. SOLUTION: The method for forming the adhesive layer 2 comprises: the coating step of selectively applying the adhesive resin solution comprised of the solute consisting of a curable resin and a volatile solvent on a silicon wafer 1 using a noncontact type coating machine; and the solvent removing step of removing the solvent in the adhesive resin solution coated on the noncontact surface. COPYRIGHT: (C)2009,JPO&INPIT
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