A SURFACE ACOUSTIC WAVE PACKAGE AND FABRICATION METHOD THEREOF

摘要

A surface acoustic wave package and a manufacturing method thereof are provided to improve reliability of a product by sealing enclosure with a sealing part and a resin layer. An exposed area exposing a part of a pad is formed in the upper side of a wafer(110) including an electrode(111) and a pad(112). Conductive metal material including Au etc. is coated on the exposed area and a bump(113) is formed in the upper side of the pad. The photoresist remained from the upper side of the wafer is removed with a dry etching process. A first dry film is adhered in the upper side of the wafer. A vertical partition(121) which surrounds the electrodes is formed by developing a first dry film. A second dry film is mounted in the top end portion of the vertical partition by laminating a second dry film having constant thickness on the top of the wafer in which the vertical partition is formed. A sealing part(120) removes the rest except for the second dry film corresponding to the electrode and blocks the electrode with an external environment. A resin layer(130) of constant thickness is formed in the upper side of the wafer. Electrodes are formed in the upper side of the wafer. A solder ball(S) is formed in the bump of the pad electrically connected with the electrode.