发明名称 METHOD FOR FILLING A VIA IN A SUBSTRATE AND PANEL COMPRISING SUCH A SUBSTRATE
摘要 A method for producing an area of light transmissivity in a generally opaque panel comprises forming an area of reduced thickness in the panel, laser drilling an array of microscopic holes in the area and thereafter filling the holes with a light transmissive material such as a curable polymer. The thinned area may also be filled with a polymer to reinforce the thinned area, and the polymer may be colored to add color to light transmitted through the pattern.
申请公布号 EP2024170(A2) 申请公布日期 2009.02.18
申请号 EP20070809186 申请日期 2007.05.23
申请人 ELECTRO SCIENTIFIC INDUSTRIES, INC. 发明人 HARDY, GREGG, E.;NASHNER, MICHAEL, S.;HOWERTON, JEFFREY
分类号 G02B6/10;B29D11/00 主分类号 G02B6/10
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