发明名称 Flip chip underfill system and method
摘要 <p>A system (30) for dispensing a viscous material onto a substrate (16) which includes a dispensing element (22), a viscous material reservoir (20) and a metering device (25) coupled between the reservoir (20) and the dispensing element (22) for metering a variable amount of a viscous material through the dispensing element (22). The dispensing element (22) and metering device (25) can be moved by a positioner (32) along a predetermined pattern adjacent a surface of a substrate (16). A weigh scale (52) located adjacent the substrate (16) receives a metered amount of the viscous material and produces signals representative of a variable weight of the material dispensed during a predetermined time interval. A controller (40) adjusts a speed of movement of the positioner (32) along the predetermined pattern to cause the dispensing element (22) to dispense a desired amount of material based on a calculated flow rate. Alternatively, the controller (40) adjusts a rate of delivery based on the calculated flow rate.</p>
申请公布号 EP1256387(B1) 申请公布日期 2009.02.18
申请号 EP20020015133 申请日期 1996.10.08
申请人 NORDSON CORPORATION 发明人 BOURAS, CARLOS E.;GAMELIN, ANDRE S.;MEIER, MARK S.;LA, DUONG T.;LEWIS, ALAN R.;BABIARZ, ALEC J.
分类号 B05C11/10;B05D1/26;B05C5/00;B05C5/02;B05D7/00;B67D7/08;B67D7/18;B67D7/82;H01L21/56;H05K1/18;H05K13/04 主分类号 B05C11/10
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