发明名称 APPARATUS FOR PLATING
摘要 A planting apparatus capable of adjusting the quantity of electric charge is provided to adjust the quantity of electric charge which reaches a supporting plate electrically connected to a cathode plate in order to control thickness of a planting layer partly. A planting apparatus(100) capable of adjusting the quantity of electric charge comprises the following units. A frame(120) accommodates an object(110) to be planted. An anode plate(130) combined with the frame is electrically connected to a power source. A cathode plate(140) combined with the frame is electrically connected to the power source. A supporting plate(150) combined with the frame is electrically connected to the cathode plate.
申请公布号 KR20090016873(A) 申请公布日期 2009.02.18
申请号 KR20070081180 申请日期 2007.08.13
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, JIN WON;SUNG, NAK YUN;YOON, JONG MIN;BAE, SU HYUN;KWON, DAE HYUN
分类号 C25D17/00 主分类号 C25D17/00
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