| 发明名称 |
Multi-layer polishing pad material for CMP |
| 摘要 |
The invention is directed to a polishing pad for chemical-mechanical polishing comprising an optically transmissive multi-layer polishing pad material, wherein the optically transmissive polishing pad material comprises two or more layers that are joined together without the use of an adhesive. |
| 申请公布号 |
EP2025469(A1) |
申请公布日期 |
2009.02.18 |
| 申请号 |
EP20080017326 |
申请日期 |
2004.06.03 |
| 申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
LACY, MICHAEL, S.;PRASAD, ABANESHWAR;SEVILLA, ROLAND, K. |
| 分类号 |
B24B49/12;B24B7/30;B24B37/20;B24D3/32;B24D13/14 |
主分类号 |
B24B49/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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