Method of modifying a surface of a semiconductor wafer

摘要

A method of modifying a surface of a semiconductor wafer comprising the steps of:
contacting said surface with a three-dimensional, textured, fixed abrasive article comprising a plurality of abrasive composites arranged in the form of a pre-determined pattern, said composites comprising a plurality of abrasive particles dispersed in a binder; and
relatively moving said wafer and said fixed abrasive article in the presence of a liquid medium to modify said surface of said wafer.