SEMICONDUCTOR APPARATUS OF FURNACE TYPE

摘要

A furnace type semiconductor facility in which spaying parts of nozzle member are arranged in process tube as multistage is provided to uniformly supply a gas to a process tube by spraying the gas into whole direction. A furnace type semiconductor facility(10) comprises a process tube(100), a wafer boat(200), and a nozzle member(400). The wafer boat is positioned inside the process tube. The nozzle member is loaded in the wafer boat, sprays a process gas into wafers, and includes a first spaying part(410a) and a second spaying part(410b) for spraying different process gas. The first spraying part and the second spraying part surround the wafer boat, and are installed at different height.