A Copper Plating Process

摘要

Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are formed. A copper plating method wherein the object to be plated and a pretreatment solution in which bromide compound ions are contained are brought into contact and copper is precipitated by means of electrical plating using a copper plating solution.