Power semiconductor module and fabrication method thereof

摘要

An elastic printed board (102) is provided so that stress applied by the silicon gel (101) is absorbed by the printed board (102). Further, the printed board (102) is formed to be so narrow that the stress may be escaped. On the other hand, the wires on which a high voltage is applied are patterned on respective printed boards. This serves to prevent discharge through the surface of the same printed board served as current passage. This design makes it possible to hermetically close the power module, prevent intrusion of moisture or contamination as well as displacement, transformation and crack of the cover plate (105).