| 发明名称 |
RESIN COMPOSITION FOR INSULATION AND LAMINATE USING THE SAME |
| 摘要 |
<p>This invention relates to an insulating resin composition which exhibits high impact resistance and heat resistance and good adhesiveness to the plating metal, is selectively etchable by a permanganate salt commonly used in a plating operation and suited for an insulating layer in multilayer wiring boards. The insulating resin composition is a photo-polymerizable or thermally polymerizable resin composition comprising 3-10 parts by weight of a crosslinked elastic polymer per 100 parts by weight of a resin component (excluding the crosslinked elastic poly and including monomers) and said crosslinked elastic polymer has carboxyl groups and is dispersed with an average secondary particle diameter in the range of 0.5-2 mum.</p> |
| 申请公布号 |
KR100884290(B1) |
申请公布日期 |
2009.02.18 |
| 申请号 |
KR20020058383 |
申请日期 |
2002.09.26 |
| 申请人 |
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发明人 |
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| 分类号 |
C08L63/00;B32B7/06;C08F2/44;C08F291/00;C08G59/42;C08L63/10;G03F7/004;G03F7/032;G03F7/038;H01L23/498;H05K3/00;H05K3/18;H05K3/28;H05K3/46;(IPC1-7):C08L63/00 |
主分类号 |
C08L63/00 |
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